Description
Specially formulated for degreasing and cleaning substrates prior to bonding. The chemical composition of this product leaves a surface which is grease and contaminant free, making good surface adhesion possible.
Uses:
Used to decontaminate all metal and certain composite substrates prior to bonding with our high performance adhesives.
Do not use on soft plastics or foamed products, which may be attacked by the solvent nature of the product.
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